Telecom Supply Chain News
The Telecom & Networking industry represents a critical segment of the global electronics supply chain. With 887+ curated articles, 1BUY.AI provides comprehensive market intelligence specifically filtered for Telecom & Networking applications. Our AI-powered platform analyzes news from hundreds of sources to deliver actionable insights on component availability, pricing trends, supplier updates, and emerging risks that could impact Telecom & Networking manufacturers and procurement teams.
The Telecom & Networking industry represents a critical segment of the global electronics supply chain. With 887+ curated articles, 1BUY.AI provides comprehensive market intelligence specifically filtered for Telecom & Networking applications. Our AI-powered platform analyzes news from hundreds of sources to deliver actionable insights on component availability, pricing trends, supplier updates, and emerging risks that could impact Telecom & Networking manufacturers and procurement teams.
Latest Telecom News
Electronics drive India’s export surge to China
India's electronics exports to China have surged significantly, with a 64% increase in July alone, driven by mobile-phone parts and telecom equipment. The Commerce Ministry reports that exports reached $7.7 billion in the first four months of FY27, indicating a strong demand for industrial inputs. However, experts caution that this growth may be linked to intra-company transactions and could be volatile. The article highlights the need for India to secure better access to the Chinese market for high-value electronics and components, despite ongoing non-tariff barriers that limit market entry for competitive Indian products.
Sivers Semiconductors and SemiNex target AI data centers with $3.4M InP program
Sivers Semiconductors and SemiNex have initiated a $3.4 million program to develop advanced indium phosphide (InP) light sources aimed at enhancing optical interconnects for AI data centers. This collaboration seeks to address the increasing demand for higher optical power and efficiency as data centers evolve towards co-packaged optics (CPO). The program includes the development of high-power external laser sources and semiconductor optical amplifier stages to support the growing optical bandwidth requirements. The initial production ramp and customer sampling are scheduled for the second half of 2027, indicating a strategic move to position both companies at the forefront of AI infrastructure scaling.
Wafer technology could lower future 6G antenna costs
A research team at Seoul National University has developed a wafer-integrated 6G antenna technology that combines antennas and RF semiconductor switches on a single wafer. This innovation aims to reduce manufacturing complexity and costs while supporting high-density antennas for future wireless communications. The technology is particularly relevant for applications in 6G mobile communications, satellite communications, and autonomous systems. The researchers plan to collaborate with foundries to scale the technology for larger wafers, which could significantly impact procurement strategies for companies involved in advanced telecommunications and semiconductor manufacturing.
Programmable DC-DC Converters Boost Power Flexibility
The article discusses the launch of TDK Corporation's new DDSM series of programmable DC-DC converters, which provide flexibility in power management for industrial applications. These converters support a wide voltage range and are designed to simplify power system designs while reducing the number of components needed. Their programmable architecture allows for adjustments to output voltage, which can help in various applications such as factory automation and telecommunications. The efficiency ratings of up to 93% also highlight their potential for reducing energy loss, making them a valuable addition to industrial equipment.
Sivers Semiconductors Announces $3.4M Program With SemiNex for Next-Generation InP Light Sources Used to Power AI Data Centers
Sivers Semiconductors has announced a $3.4 million program with SemiNex to develop next-generation indium phosphide (InP) light sources for AI data centers. This initiative aims to enhance optical networking capabilities by providing high-power, multi-wavelength light sources essential for co-packaged optics and wavelength-multiplexed links. The partnership highlights the critical role of advanced light sources in scaling AI infrastructure, as they are becoming a key factor in system-level design challenges. Customer sampling and early production are targeted for the second half of 2027, indicating a significant timeline for procurement planning in the optical component space.
Nokia expands compound semi footprint
Nokia has announced its acquisition of NXP's semiconductor fabrication facility in Chandler, Arizona, which will be converted for InP semiconductor production aimed at optical components. This move is part of Nokia's strategy to enhance its domestic manufacturing capabilities in response to increasing demand for secure and scalable semiconductor supply, particularly in the context of the AI supercycle. The acquisition is expected to close in Q1 2029, with initial leasing of the facility starting in early 2027. Additionally, Nokia is ramping up production at its new San Jose fab and significantly increasing its advanced test and packaging capacity in Pennsylvania by 10x, indicating strong future demand for its semiconductor products.
Laser Sends 600W of Power Over 400 Metres
Olee Space has successfully demonstrated a laser-based wireless power transfer technology, transmitting 600W of power over a distance of 400 meters. This innovation could significantly impact applications where traditional power delivery is challenging, such as powering 5G base stations, eVTOLs, and IoT devices. The technology features a proprietary optical receiver with high conversion efficiency and advanced tracking capabilities to maintain alignment with the laser beam. This development indicates a potential shift in energy delivery methods, particularly in remote or outdoor environments, which could influence procurement strategies for companies involved in telecommunications and energy sectors.
GCT Semiconductor Q2 Earnings Call Highlights
GCT Semiconductor reported a revenue decline of 18% year-over-year, totaling $1 million, due to shifts in customer deployment schedules, although demand for its 5G chipsets remains strong. The company shipped over 5,100 chipsets in Q2 2026, a 71% increase from the previous quarter, with expectations for continued growth in the second half of the year. GCT is focusing on expanding its market presence in terrestrial broadband, satellite connectivity, and industrial IoT applications. However, management noted that the timing of customer production schedules may impact revenue forecasts, emphasizing the need for procurement teams to monitor these developments closely.
OpenLight and Tower Semiconductor Enable Photonic IC Design on InP-on-Silicon Platform
OpenLight and Tower Semiconductor have launched a photonic Process Design Kit (PDK) for Tower's PH18DA InP-on-silicon platform, enabling the design of photonic integrated circuits (PICs) in a standard semiconductor environment. This collaboration aims to streamline the development of advanced optical systems for applications such as AI infrastructure and optical interconnects. The integration of OpenLight's photonics IP with Tower's manufacturing capabilities and Cadence's EDA tools enhances design efficiency and supports the fabrication of high-performance PICs. This development is significant for procurement teams as it indicates a growing focus on photonic technologies, which could impact sourcing strategies for components related to optical systems.
OpenLight and Tower Semiconductor Launch OpenLight PDK on Cadence Tools for PH18DA InP-on-Silicon Photonics Platform
OpenLight and Tower Semiconductor have launched a new photonic Process Design Kit (PDK) compatible with Cadence's electronic design automation tools, aimed at enhancing the design capabilities for photonic integrated circuits (PICs) on Tower's PH18DA platform. This integration allows for more efficient design processes, particularly for applications in optical interconnects and AI infrastructure. The collaboration is expected to streamline the transition from design to production, potentially accelerating market entry for new technologies. This development follows OpenLight's recent funding round, indicating strong commercial momentum in the photonics sector.
US semiconductor push offers Việt Nam opportunities, policy challenges
The article discusses the implications of the US's semiconductor strategy, particularly the CHIPS and Science Act, which allocates $52.7 billion for semiconductor support. This initiative presents opportunities for Vietnam to enhance its role in global supply chains, especially in semiconductor manufacturing and advanced packaging. However, the article highlights challenges such as skilled labor shortages and infrastructure constraints that could hinder Vietnam's ambitions. The US's focus on semiconductor development as a geopolitical strategy underscores the importance of Vietnam's position in the supply chain, particularly as it seeks to transition from an electronics manufacturing hub to a key player in the semiconductor ecosystem.
Adapter Supports High-Speed Networking
Antmicro has introduced a new Thunderbolt to dual-10-gigabit-Ethernet adapter, enhancing high-speed networking capabilities. The open-hardware design includes complete KiCad files for developers to modify and manufacture their own versions. This initiative supports the growing demand for high-speed networking solutions, particularly in sectors like telecom and data centers. The adapter features Intel’s JHL6340 Thunderbolt 3 controller and dual 10GBASE-T Ethernet ports, providing flexibility for various networking hardware. This development reflects a trend towards open-source hardware, which may influence procurement strategies as companies seek to adapt and innovate in their networking solutions.