📊Executive Summary

Samsung has successfully taped out its 3nm SoCs using gate-all-around (GAA) technology, aiming to start fabrication in 2022. This advancement positions Samsung to compete closely with TSMC in the semiconductor foundry market. The new process is expected to enhance performance significantly while reducing energy consumption and chip area. Samsung's 3nm GAA node could facilitate the production of next-generation mobile device components, including 5G and AI applications, potentially increasing its market share in the wireless sector. This development is crucial for procurement teams as it indicates a shift in the semiconductor landscape, with implications for sourcing strategies and supplier engagements....