📊Executive Summary

TSMC's announcement of a US$100 billion investment in the United States is a strategic move aimed at reducing geopolitical risks associated with its operations in Taiwan. This investment will involve the construction of three wafer fabs and two advanced packaging plants, although these facilities are not expected to achieve mass production until after 2030. The investment is part of a broader trend of semiconductor companies diversifying their manufacturing locations to mitigate risks from trade tensions and global disruptions. While this move may enhance TSMC's long-term stability, it is projected to reduce Taiwan's dominance in the global semiconductor market over the next five years, which could impact procurement strategies for companies relying on Taiwanese chip production....