📊Executive Summary

Intel Corporation and 3DGS Inc. have announced a $3.3 billion investment to establish a semiconductor substrate manufacturing facility in Odisha, India. This facility will focus on producing advanced packaging glass core substrates and high-density interconnect substrates, which are essential for semiconductor devices. The project is expected to create over 1,800 high-skilled jobs and aligns with the Indian government's strategy to boost domestic semiconductor manufacturing. This development is significant for procurement teams as it indicates a growing capacity in semiconductor substrates, which are critical components for various electronics applications....