📊Executive Summary

Intel and 3DGS have announced a $3.3 billion investment to build a semiconductor substrate manufacturing facility in Odisha, India. This facility will focus on producing advanced packaging glass core substrates and high-density interconnect substrates, which are essential for semiconductor manufacturing. The project is expected to create over 1,800 high-skilled jobs and aligns with the Indian government's strategy to boost domestic semiconductor production. This development may influence sourcing strategies for companies reliant on semiconductor substrates, as it represents a significant investment in the region's manufacturing capabilities....