📊Executive Summary

The article discusses the increasing complexity of ensuring end-to-end security in semiconductor manufacturing due to new regulations and the use of multi-die assemblies. Chipmakers face challenges in tracking components from multiple vendors, which complicates security and quality assurance. The integration of heterogeneous chiplets from different foundries adds layers of risk, particularly with aging components under varying workloads. This complexity is slowing the development of a commercial chiplet marketplace, as consistent data tracking across different manufacturers is lacking. Procurement teams should be aware of these challenges as they could impact sourcing decisions and the reliability of components....