📊Executive Summary

Intel and 3DGS Inc. have announced a joint investment of $3.3 billion to establish a semiconductor substrate manufacturing facility in Odisha, India. This facility will focus on advanced packaging glass core substrates and high-density interconnect substrates, essential components in semiconductor manufacturing. The project is expected to create over 1,800 high-skilled jobs and aligns with the Indian government's strategy to boost domestic semiconductor manufacturing. This development is significant for procurement teams as it may impact sourcing strategies and availability of critical semiconductor components in the future....