📊Executive Summary

The article discusses significant shortages in the IC packaging supply chain due to an unexpected spike in demand for integrated circuits (ICs). This demand surge has led to constraints in manufacturing capacity, particularly affecting 200mm wafer bumping, which is crucial for chip-scale packages and RF front-end modules. Packaging houses are operating at full capacity, resulting in longer lead times and potential revenue impacts for customers. The situation is expected to persist into 2018, indicating a prolonged supply shortage. This scenario highlights the need for procurement teams to monitor capacity and lead times closely as they navigate the complexities of sourcing in a constrained environment....